Systems for enabling chassis-coupled modular mobile electronic devices

ABSTRACT

A system for enabling a chassis-coupled modular mobile electronic device includes a thermally conductive chassis, a set of module couplers that couple modules of the modular mobile electronic device to the chassis (both thermally and mechanically), a module communication network configured to enable data transfer between the modules, and a module power network configured to enable power transfer between the modules when the modules are coupled to the chassis.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/976,195, filed on 7 Apr. 2014, of U.S. Provisional Application No.61/976,215, filed on 7 Apr. 2014, and of U.S. Provisional ApplicationNo. 62/040,860, filed on 22 Aug. 2014, all of which are incorporated intheir entireties by this reference.

TECHNICAL FIELD

This invention relates generally to the mobile electronics field, andmore specifically to new and useful systems for enabling chassis-coupledmodular mobile electronic devices in the mobile electronics field.

BACKGROUND

Current methods of mobile electronic device design create devices thatare static, both in terms of functionality and in terms of design.Companies try to solve this problem by producing a wide range of deviceshaving different functionalities and different designs. As a result,users of such devices are forced to make compromises; they lack theability to customize the functionality and design of their mobiledevices to truly meet their needs and preferences. Thus, there is a needin mobile electronics field to create systems for enablingchassis-coupled modular mobile electronic devices. This inventionprovides such new and useful systems.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an exploded model view of a system of an invention embodiment;

FIG. 2 is a model view of a system of an invention embodiment;

FIGS. 3A and 3B are image views of example mobile electronic devicesbased on a system of an invention embodiment;

FIG. 4 is an exploded model view of an example module;

FIG. 5 is a diagram view of a modular electronic device enablementsystem of a system of an invention embodiment;

FIG. 6 is a perspective view of a module interface of a modularelectronic device enablement system of a system of an inventionembodiment;

FIG. 7 is a diagram view of a battery of a modular electronic deviceenablement system of a system of an invention embodiment;

FIG. 8 is a perspective view of a module coupler of a system of aninvention embodiment;

FIG. 9 is a perspective view of a module coupler of a system of aninvention embodiment;

FIG. 10 is a perspective view of a module coupler of a system of aninvention embodiment;

FIG. 11 is a perspective view of a spring-loaded magnetic insert of amodule;

FIG. 12 is a model view of a system of an invention embodiment;

FIG. 13 is a diagram view of module interfaces of a modular electronicdevice enablement system of a system of an invention embodiment;

FIG. 14 is a diagram view of module couplers of a system of an inventionembodiment;

FIG. 15 is a diagram view of module coupler backplanes of a system of aninvention embodiment;

FIG. 16 is a model view of a front module coupler backplane of a systemof an invention embodiment;

FIG. 17 is a model view of a system of an invention embodiment;

FIG. 18 is a diagram view of chassis of a system of an inventionembodiment;

FIG. 19 is a thermal view of a system of an invention embodiment;

FIG. 20 is a model view of an integrated active heat transfer system ofa system of an invention embodiment; and

FIG. 21 is a perspective view of an antenna integrated into a chassis ofa system of an invention embodiment.

DESCRIPTION OF THE INVENTION EMBODIMENTS

The following description of the invention embodiments of the inventionis not intended to limit the invention to these invention embodiments,but rather to enable any person skilled in the art to make and use thisinvention.

As shown in FIG. 1 and FIG. 2, a system 100 for enabling chassis-coupledmodular mobile electronic devices includes a modular electronic deviceenablement system 110, a plurality of module couplers 120, and a chassis130.

The system 100 functions to enable the creation or modification ofchassis-coupled modular mobile electronic devices through the use ofuser-removable modules. Modules are preferably coupled to the system 100via the module couplers 120 and are preferably connected to each othervia the modular electronic device enablement system 110 (hereafterreferred to as the MEDES 110). The chassis 130 provides structure to thesystem 100 and is preferably mechanically coupled to both the modulecouplers 120 and the MEDES 110. After connecting to the system 100modules preferably are able to communicate with each other and/or sendpower to each other using the MEDES 110. When multiple modules areconnected to the system 100, the system 100 preferably enables themodules in confederation to serve as a mobile electronic device. Themobile electronic device created by such a confederation is preferablycharacterized by the confederated modules as well as the parameters ofconfederation, which are preferably determined by the system 100 and theconfederated modules.

As shown in FIG. 3A, a chassis-coupled modular mobile electronic deviceconfigured to serve as a smartphone is an example of a possible mobileelectronic device enabled by the system 100. As shown in FIG. 3B, achassis-coupled modular mobile electronic device configured to serve asa camera is an example of a possible mobile electronic device enabled bythe system 100. Other examples of possible mobile electronic devicesinclude those configured to serve as tablets, laptops, media players,cameras, measurement devices, gaming systems, vehicular computingdevices, set-top boxes, and televisions.

Modules connected by the system 100 are preferably user-removable andreplaceable, enabling users to create mobile electronic devices withhighly varied form and functionality. For example, a user may connect acamera module, a flash memory module, a processor module, a batterymodule, and a touchscreen LCD module to the system 100 to create a smalland lightweight camera as shown in FIG. 3B. The user could later add acell-phone radio module and a microphone/speaker module to create acamera phone. Modules preferably follow an open standard, enabling thirdparty developers and entities to develop modules.

As shown in FIG. 4, an example module includes a module base, moduleelectronics, a module radio-frequency (RF) shield, and a module cover.The module base of the example module provides structure and heattransfer for the module. The module electronics of the example moduleprovide the main functionality of the module and enable connection tothe system 100 through the module connector. The module RF shield of theexample module prevents external RF transmission from affecting themodule. The module cover of the example module seals the module (andprotects the module electronics). The module cover of the example moduleis user-replaceable, allowing for customization of the appearance and/orfunctionality of the module.

The flexibility afforded by module confederation may enable a number ofpotentially favorable outcomes. Users can purchase only the modulesnecessary for their needs, allowing for reductions in cost. Users canalso choose to replace modules or add additional modules at a latertime. In combination, these two outcomes may help increase accessibilityto mobile electronic devices (and in many cases, the internet)throughout the world, especially for people for whom a smartphone or aPC is not currently a good value proposition. These two outcomes alsohelp slow the creation of electronic waste by allowing mobile electronicdevices to be upgraded or modified rather than replaced. Further,because the system 100 is compatible with modules of highly varied formand function, and because modules are preferably based on an openstandard, module confederation allows small or specialized companies tomake modules playing to their strengths without designing a full mobileelectronic device.

The system 100 is preferably compatible with a large range of moduletypes. Modules preferably may serve any function or purpose as long asthey are capable of connecting to and communicating through the system100. Some example module types include sensor modules, processormodules, storage modules, communication modules, display modules, andpower modules Examples of sensor modules include accelerometer modules,GPS modules, camera modules, depth imaging modules, fingerprint readermodules, biometric modules, microphone modules, digital/analog inputmodules, haptic input modules, infrared flash modules, pedometermodules, barometer modules, magnetometer modules, and gyroscope modules.Examples of processor modules include application processor modules andgraphics processor modules. Examples of storage modules include flashmemory modules and RAM modules. Examples of communication modulesinclude Wi-Fi radio modules, GSM/CDMA radio modules, HDMI connectormodules, NFC modules, Bluetooth radio modules, and USB connectormodules. Examples of display modules include touchscreen LCD modules ande-ink display modules. Examples of power modules include batterymodules, solar panel modules, and battery charging modules. Note thatthese example module types are in no way exhaustive or exclusive; i.e.,modules may incorporate functionality from many of these example typesor from none at all, and modules may additionally or alternativelyincorporate functionality not herein described.

As shown in FIG. 5, the modular electronic device enablement system(MEDES) 110 functions to enable modules in confederation to serve as amodular electronic device. The MEDES 110 is preferably substantiallysimilar to the system of U.S. patent application Ser. No. 14/462,849,which is incorporated in its entirety by this reference, but mayadditionally or alternatively be any suitable system.

The MEDES 110 preferably includes a module communication network 111,but may additionally or alternatively include a module power network 112and a plurality of module interfaces 113. Modules are preferablyconnected to the MEDES 110 through the module interfaces 113 but mayadditionally or alternatively be connected to the MEDES 110 in anysuitable manner.

The module communication network 111 functions to allow for datacommunication between the modules connected to the MEDES 110. Datatransfer over the module communication network 111 is preferably highspeed, low power, reliable, and robust. The module communication network111 preferably allows for data communication whenever modules arecommunicatively coupled to the MEDES 110 (that is, they are coupled insuch a way that modules may communicate with the module communicationnetwork-over wired connections, wirelessly, or otherwise). The modulecommunication network 111 preferably enables direct communicationbetween any two modules connected to the MEDES 110, but may additionallyor alternatively enable indirect communication between modules connectedto the MEDES 110 (e.g. enabling one module to communicate with anothermodule through an intermediary module). The module communication network111 preferably enables direct communication between modules byconnecting each module to a module communication network switch, but mayadditionally or alternatively enable direct communication betweenmodules using any alternative connection architecture (e.g., connectingmodules to a data bus).

Direct communication preferably refers to data transfer that does notrequire a host or intermediary module for communication. For example, inthe case of a an module communication network 111 utilizing a switch,modules are preferably able to communicate directly by sending packetsto the switch, which then are sent directly to other modules based onthe destination address (set by the originating module). This isdistinct from an architecture that requires a host; for example,peripheral devices connected to a USB bus require a master device to beable to pass information between each other. Another consequence of thisis the maximum bandwidth available for inter-device communication may beinherently limited by the bandwidth of connections to the master deviceand the processing capability of the master device.

The module communication network 111 preferably connects to the moduleinterfaces 113 electrically via conductive wires, but may additionallyor alternatively connect to the module interfaces 113 via any suitableconnection method. In one example, the module communication network 111connects to the module interfaces 113 using optical connections. In thisexample, the module communication network 111 might include lightemitters and detectors for each module interface 113; the light might bepassed through fiber optics, through an optical backplane, or throughanother type of waveguide or optical circuit component.

The module power network 112 functions to distribute power to modulesconnected to the MEDES 110. The module power network 112 preferablyenables any module connected to the MEDES 110 to send power to orreceive power from any other module connected to the MEDES 110. Themodule power network 112 preferably enables power transfer betweenmodules by connecting each module interface 113 to a common power bus ofthe module power network 112, but may additionally or alternativelyenable direct power transfer between modules using any alternativeconnection architecture (e.g., a switched power architecture). Themodule power network 112 in particular preferably supports three typesof modules (note that some modules may be more than one type): powerconsuming modules (e.g. camera, display), power producing modules (e.g.charger, solar panel), and power storing modules (e.g., batteries,capacitors). The module power network 112 preferably supportshot-swapping modules, including battery modules. The module powernetwork 112 preferably connects to the module interfaces 113 viaconductive wires but may additionally or alternatively connect to themodule interfaces 113 electrically via any suitable connection method.

The module interfaces 113 function to enable the connection of modulesto the MEDES 110. The module interfaces 113 preferably allow for modulesto connect to both the module communication network 111 and the modulepower network 112; the module interfaces 130 are preferably connected tothe module communication network 111 and the module power network 112with conductive wires, but may additionally or alternatively beconnected to the module communication network 111 and the module powernetwork 112 in any suitable manner as previously described. The moduleinterfaces 113 may connect modules to the module communication network111 and the module power network 112 in any suitable manner (e.g.electrically, optically); the manner of connection to the modulecommunication network 111 and the manner of connection to the modulepower network 112 for a given module may be of the same types or ofdifferent types. For example, modules may connect to the moduleinterface 113 using contact methods (e.g. conductive contact via plugand socket) and/or non-contact methods (e.g. optical, capacitive,inductive, and RF data/power transfer methods). As shown in FIG. 6, amodule may (through the module interface 113) connect to the modulecommunication network 111 using non-contact inductive data transfermethods and to the module power network 112 using conductive contact viaa spring pin to conductive pad interface.

The module interfaces 113 are preferably identical, allowing anycompatible modules to connect to any module interface 113 of the MEDES110, but may alternatively be non-identical (e.g. separate interfacetypes for different module types).

The module interfaces 113 are preferably integrated into or otherwiseconnected to the module couplers 120, but may additionally oralternatively be separate of the module couplers 120.

The MEDES 110 may additionally include a MEDES battery 114. The MEDESbattery 114 functions to make sure that the MEDES 110 has power evenwhen no power source module is connected (enabling, for instance, thehot-swap of battery modules). The MEDES battery 114 may additionallyprovide power to other modules (e.g. while a battery module is beinghot-swapped for another). The MEDES battery 114 may additionally providepower to other modules (e.g. while a battery module is being hot-swappedfor another). The MEDES battery 114 may be any type of power storagedevice (e.g., Li-Ion battery, supercapacitor, compressed fluid storage).As shown in FIG. 7, the MEDES battery 114 preferably includes a chargingcircuit that includes a charge controller, a charging switch, and anideal diode controller. This charging circuit preferably preventscurrent from flowing into the battery of the MEDES 110 when the batteryis not being charged (via the ideal diode controller), and also managesthe rate and method of charging when the battery is being charged (viathe charge controller).

The MEDES 110 is preferably managed by controllers within the MEDES 110,but may additionally or alternatively be managed by the modulesthemselves or any other suitable management mechanism. Managing theMEDES 110 preferably includes monitoring and/or controlling data andpower over the module communication network 111 and the module powernetwork 112.

The MEDES 110 may additionally manage modules, either as they relate tomodule communication network 111 and module power network 112 operationor for any other reason. For instance, the MEDES 110 may connect tothermal sensors integrated into the chassis 130, and in this way, detectthermal properties of modules connected to the system 100. The MEDES 110may be able to instruct a module to reduce power consumption if themodule begins to overheat, for instance, and if the module does notrespond, the supervisory controller may cut off power via the modulepower network 112 to the module to protect the module and/or the system100 from damage. The MEDES 110 may also perform functions such asinstructing one module to go to a sleep mode based on signals from othermodules; for example, putting a display module to sleep after detectinga period of inactivity from a motion-detecting module.

The module couplers 120 function to couple modules to the system 100.The module couplers 120 may couple modules to the system 100mechanically, thermally, electrically, magnetically, and/or optically.The module couplers 120 are preferably themselves coupled to the chassis130, and are more preferably removably fixed to the chassis 130, but mayadditionally or alternatively be integrated into the chassis 130.

The module couplers 120 preferably couple modules mechanically to thechassis 130. More specifically, modules preferably mechanically coupleto the module couplers 120; the module couplers 120 are themselvescoupled to or part of to the chassis 130, enabling module to chassis 130coupling. The module couplers 120 preferably hold the modules securely,but also allow modules to be removed when desired. The module couplers120 preferably substantially limit module movement when modules arefully coupled to the module couplers 120 to allow for precise alignment(e.g. to align contact pads) but may additionally or alternatively allowsome module movement along some degree of freedom. The module couplers120 preferably have mechanical guides or other guides to aid in aligningthe module during coupling, but may alternatively have no such guides.If the module couplers 120 have mechanical guides, the mechanical guidespreferably aid in module retention through friction. The guides arepreferably defined by a cavity with a geometric profile that iscomplementary to at least a portion of the profile of a module as shownin FIG. 8. The cavity additionally includes an open portion that enablesinsertion of a module from along at least one axis; e.g., axial motionand/or rotational motion of a module into the space defined by thecavity. The open portion preferably restricts insertion to a single axis(i.e., modules may be inserted only along a line, as shown in FIG. 8),but may additionally or alternatively allow insertion in multiple axes).The open portion may further restrict insertion to a single direction(as shown in FIG. 8), or may allow insertion to occur in multipledirections per axis (e.g., the display module as shown in FIG. 16 may beinserted from either the left or the right). The module couplers 120 mayhave detents; e.g., structures that resist the movement of the moduleswhen they are fully coupled to the module couplers. Example of thesestructures include spring-loaded balls mounted on a surface of themodule that fit into corresponding shallow holes on a complementarysurface of the module coupler 120 (or vice versa), or magnets mounted ona surface of a module and a complementary surface on a module coupler120.

Modules may be coupled to the module couplers 120 by sliding the modulesinto the module couplers 120, pressing the modules into the modulecouplers 120, plugging the modules into the module couplers 120,screwing the modules into the module couplers 120, latching the modulesinto the module couplers 120, or any other suitable method of coupling.In the case where the module couplers 120 couple to modules usingnon-contact force (e.g. electrostatic or magnetic force), coupling maysimply involve placing a module in the correct spot on a module coupler120. For example, module couplers 120 may include magnets thatautomatically align modules correctly even they are initially positionedby in an unaligned state.

The modules preferably sit proud of the module couplers 120 on allexposed surfaces of the modules, but may alternatively sit flush orsunken relative to the module couplers 120 on some or all exposedsurfaces of the modules.

The module couplers 120 are preferably fabricated from a rigid material,and more preferably are fabricated from metal, but may alternatively befabricated in whole or in part from any other material, includingflexible and non-metallic materials.

As shown in FIG. 8, the module couplers 120 are preferably designed tocontact a module of a soft trapezoidal shape on four surfaces (i.e.,soft-trapezoidally-shaped modules); three sides of the module and thebottom of the module. The module coupler 120 is preferably coupled tothe module when the module is slid fully into the module coupler 120.The module coupler 120 preferably retains the module in least in partvia friction on the contact surfaces. The module coupler 120 mayadditionally also retain the module with a retention mechanism; forexample, magnets placed on the far edge of the module coupler 120 andthe corresponding edge of an inserted module.

In a variation of an invention embodiment, module couplers 120 includeelectropermanent magnets (EPMs), as shown in FIG. 9. The module andmodule coupler 120 preferably have complementary interface pads; themodule coupler 120 preferably has an electropermanent magnet while themodule has a complementary magnetic attachment point (e.g., aferromagnet). When the module is slid into the module coupler 120, themechanical rails enable the module to be guided into an attachmentposition, where the interface pads of the module and the module coupler120; then, the electropermanent magnet is activated to secure the modulein that position. Additionally or alternatively, the module may have anelectropermanent magnet while the module coupler 120 has a complementarymagnetic attachment point.

If the module coupler 120 includes an EPM, the module coupler 120preferably also includes EPM circuitry. The EPM interface functions toprovide a low power, electronically controllable means to securelyattach modules to other modules and/or modular mobile electronicdevices. The EPM interface preferably has two selectable states: anattached state and a released state, corresponding to high and lowlevels of magnetic force. Power is required when switching between theattached state and released state, but power is preferably not requiredto maintain either state. EPM interfaces preferably provide enoughmagnetic force (in conjunction with a soft magnet, permanent magnet, orother EPM) in the attached state to prevent modules from beingmechanically de-coupled; in the released state, EPMs preferably providea slight retaining force, allowing modules to be mechanically de-coupledwith a small applied force. A soft magnet is preferably formed of softmagnetic material (e.g. annealed iron, the alloy known as Hiperco 50®).Additionally or alternatively, EPMs may provide no retaining force ormay provide a repelling force, potentially allowing modules to bemechanically de-coupled without an applied force. If the module coupler120 includes mechanical rails as previously described (or otherwiseaccepts module insertion along a single direction), the EPM preferablycouples to a magnetic material on a surface perpendicular to thedirection of modular insertion. Coupling on a surface perpendicular tothe direction of modular insertion preferably reduces the amount ofshear force experienced at the interface and therefore increasescoupling strength.

Additionally or alternatively, the EPM may couple to a magnetic materialin any location that aids in module mechanical coupling.

As shown in FIG. 9, the EPM functions to provide, in conjunction with asoft magnet, permanent magnet, or other EPM, a magnetic force. In oneimplementation, the EPM is constructed of alternating N42SH (sinteredneodymium-iron-boron) magnets and AlNiCo (aluminum-nickel-cobalt)magnets surrounded by wire coil, separated by the alloy known as Hiperco50®. The N42SH magnets are magnetized parallel to the long axis of theEPM 131, with each alternating N42SH magnet magnetized opposite to theprevious N42SH magnet. The AlNiCo magnets are preferably magnetizedtogether in one of two states: either in the same direction as thecorresponding N42SH magnets (corresponding to the attach state) or inthe opposite direction of the corresponding N42SH magnets (correspondingto the release state). Additionally or alternatively, some Alnicomagnets are magnetized opposite and some are magnetized in the samedirection as the corresponding N42SH magnets, creating a state withmagnetic holding force in between that of the attach and release states.

EPM circuitry functions to switch the EPM from one state to another. TheEPM circuitry preferably includes a boost circuit to increase supplyvoltage and a high-value capacitor to store current. The EPM circuitrypreferably charges the high value capacitor and then discharges it in ahigh current pulse across the wire coils of the EPM, enabling an EPMstate change. The wire coils may receive current pulses individually ortogether; further, more than one current pulse per wire coil may be usedto enable the EPM state change.

The module coupler 120 may also retain the module using a latchingmechanism; for example, a pin that when extended prevents the modulefrom being removed (the pin would be retracted to remove the module), ora snap latch that holds the module tight against the contact surfaces ofthe module coupler 120 when engaged.

In a variation of an invention embodiment, the module coupler 120includes an EPM sunken into the surface of the module coupler 120, asshown in FIG. 10. The module has a corresponding magnetic insert blockthat is spring-mounted to the module such that in a default state thespring holds the magnetic insert below the surface of the module (i.e.,the magnetic insert does not stick out of the module), as shown in FIG.11. When the module is positioned over the EPM and the EPM is in anattached state, the magnetic force of the EPM on the magnetic insertpulls the magnetic insert into the EPM depression on the surface of themodule coupler 120, preventing the module from moving in a directionperpendicular to the vertical direction (i.e., the direction themagnetic insert moves).

The module couplers 120 preferably couple modules thermally to thechassis 130, but may additionally or alternatively thermally isolatemodules from the chassis 130. The module couplers 120 are preferablymade of thermally conductive materials, but alternatively may be made ofmaterials of any thermal conductivity. The module couplers 120 arepreferably thermally coupled to both the modules and the chassis 130,allowing heat to flow from the modules into the chassis 130 and viceversa. The module couplers 120 may additionally integrate heat transferfeatures; for instance, the module couplers 120 may include fins toallow heat from modules or the chassis 130 to dissipate in air. Asanother example, the module couplers 120 may include thermoelectricdevices, fluid channels, or other active or passive heat transfermechanisms.

The module couplers 120 preferably couples modules electrically (e.g.conductively, capacitively, inductively) to the MEDES 110. The modulecouplers 120 may additionally or alternatively couple moduleselectrically to the chassis 130 (for instance, grounding the case of amodule to the chassis 130). The module couplers 120 preferably couplemodules electrically to the MEDES 110 by positioning module interfaces113 within the module couplers 120 (for instance, by cutting holes forthe module interfaces 113 through the module couplers 120), but mayadditionally or alternatively couple modules electronically to the MEDES110 in any suitable way. The module couplers 120 preferably assist inthe electrical coupling of modules to the module interfaces 113 byphysically aligning the electrical connectors of modules to the moduleinterfaces 113 when the modules are fully coupled to the module couplers120. Each module coupler 120 may include one or more module interfaces113 (allowing some modules to connect to more than one module interface113).

The module couplers 120 may additionally or alternatively couple modulesoptically to the MEDES 110. The module couplers 120 preferably performoptical coupling by aligning optical connectors on modules to opticalconnectors on module interfaces 113, but may additionally couple modulesoptically to the MEDES 110 in any suitable way.

The module couplers 120 may additionally or alternatively couple tostructures other than modules. For example, a module coupler 120 maymechanically couple to a module blank (i.e. a cover designed to coverand/or fill an unused module coupler 120). As another example, a modulecoupler 120 may mechanically couple to an attachment structure (e.g. astructure designed to attach the module coupler 120 to anotherstructure). A purely mechanical attachment structure might, forinstance, include a bicycle mount that occupies a module slot. Modulecouplers 120 might additionally or alternatively couple electrically toattachment structures. The same bicycle mount attachment structure mightinclude wires linked to a generator circuit that charges the system 100through the module coupler 120 when a user pedals the bicycle.

The module couplers 120 are preferably removably fixed to the chassis130, but may additionally or alternatively be coupled to the chassis 130in any suitable manner. The module couplers 120 may be attached to thechassis 130 in a manner substantially similar to any of the ways modulesmight be attached to the module couplers 120 (e.g. by friction, bynon-contact force, with screws, etc.).

As shown in FIG. 1, the module couplers 120 are preferably coupled tothe chassis in a set in a module coupler backplane 121, but mayadditionally or alternatively be coupled to the chassis 130 individuallyor in any other suitable manner. The module coupler backplane 121 ispreferably part of the chassis 130 but may alternatively be separatefrom the chassis 130. In one embodiment, two module coupler backplanes121 (one for front side modules and another for backside modules) coupleto form the chassis 130, sandwiching the MEDES 110 in-between. Themodule couplers 120 may additionally or alternative be organized intoany number of module coupler backplanes 121 arranged into any suitablearrangement.

As shown in FIG. 12, modules and module couplers 120 are preferablysized according to a grid system. More specifically, module couplers 120are preferably sized according to a square grid pattern, starting with aunit size of 1×1. Additionally or alternatively, any suitable regular orirregular geometric grid or pattern may be used such as a hexagonalgrid. Dimensions of modules and module couplers 120 may then be anypositive integer multiple of the unit size (e.g. 1×2, 2×2, 1×3, 2×3, 3×3. . . ) As shown in FIG. 13, module couplers 120 are preferably designedso that module coupling is rotationally symmetric; that is, a rotated2×1 module should be able to couple to a 1×2 module coupler 120.Additionally or alternatively, module coupling may not be rotationallysymmetric. Further, if there are multiple module interfaces 113 permodule coupler 120, multiple modules may be able to connect per modulecoupler 120 (also as shown in FIG. 13). The multiple modules mayadditionally or alternatively couple together with an adapter (e.g. aclip-on rib) to allow them to fit securely in the module coupler 120.The module coupler backplane 121 likewise preferably arranges modulecouplers 120 according to a grid system.

As shown in FIG. 14, the module interfaces 113 of the MEDES 110 arepreferably laid out in accordance with the grid system. Further, themodule interfaces 113 are laid out in such a way to enable rotationallysymmetric coupling for a particular grid layout, as previouslymentioned. As shown in FIG. 15, the module interfaces 113 are alsopreferably laid out to allow different configurations of the modulecoupler backplane 121. This preferably includes placing more than onemodule interface 113 per module coupler 120 when the module coupler 120is intended to couple with modules larger than unit size (i.e. 1×1).These configurations are preferably achieved by replacing the modulecoupler backplane 121. Additionally or alternatively, the module couplerbackplane 121 may be physically reconfigurable (e.g., thespine/ribs/other module coupler 120 features may bemoveable/removable/replaceable on the module coupler backplane).

The system 100 preferably includes a front module coupler backplane anda rear module coupler backplane. The rear module coupler backplane ispreferably substantially similar to the module coupler backplane 121 ofFIG. 1, and functions to couple most modules to the system 100. As shownin FIG. 16 (and FIG. 2), the front module coupler backplane ispreferably designed to couple exceptionally large modules (particularlydisplay modules) and other user input/output related modules to thesystem 100. For example, the front module coupler backplane might bedesigned to couple a keyboard module or other user-input module to thefront of the system 100. The front module coupler backplane and the rearmodule coupler backplane preferably use different grid sizes, butalternatively may use the same grid sizes (or may organize modulecouplers 120 in any suitable arrangement). Further the front and rearmodule coupler backplanes preferably use different methods for securingmodules to the module coupler backplanes, but may alternatively use thesame methods for securing modules.

As shown in FIG. 17, the module coupler backplane 121 and/or chassis 130preferably enables modules to extend beyond the dimensions of a modulecoupler 120 and the module coupler backplane 121 and/or chassis 130.

The chassis 130 functions to provide structural support to the system100. As previously described, the chassis 130 may include, integrate, orbe formed fully or partially from module coupler backplanes 121 or maybe separate from any module coupler backplanes 121. The chassis 130preferably at least partially encloses the MEDES 110, and morepreferably encloses all of the MEDES 110 except for the moduleinterfaces 113, but may additionally or alternatively couple to theMEDES 110 in any suitable manner. The MEDES 110 is preferably fixed tothe chassis 130, but may alternatively be removable from the chassis130. If the MEDES 110 includes a MEDES battery 114, the MEDES battery114 is preferably removably fixed to the chassis 130 and electricallycoupled to the MEDES 110, enabling the battery to be changed, but theMEDES battery 114 may additionally or alternatively be coupled to thechassis 130 and MEDES 110 in any suitable way. The chassis 130 ispreferably of a rigid material to enable structural stability of thesystem 100, but may additionally or alternatively have any materialcomposition. In a variation of an invention embodiment, the chassis 130is preferably formed of a flexible material (e.g., the chassis 130 is awrist band that accepts three modules around the band, such that themodular mobile electronic device formed with the chassis is similar inappearance to a smart watch).

As shown in FIG. 18, chassis 130 (and/or module coupler backplanes 121)may be fabricated in multiple sizes for a given module grid size system,enabling modules of that grid size to be used flexibly across systems100.

As shown in FIG. 19, the chassis 130 preferably also functions tothermally couple modules to each other. The chassis 130 preferablythermally couples to modules through the module couplers 120. Thechassis 130 is preferably fabricated at least partially of a thermallyconductive material (e.g. metal), enabling heat produced by modules todiffuse across the chassis. Allowing heat transfer preferably reducesheat concentration in modules coupled to the system 100, which canprevent damage to the system 100 or connected modules. The chassis 130preferably enables thermal coupling of the modules through conductiveheat transfer through the solid bulk of the chassis 130, but mayadditionally or alternatively enable thermal coupling through any otherheat transfer means.

The chassis 130 may include structural features to assist heat transfer;for example, the chassis 130 may include passive heat transfer features;for example, passive heat exchangers designed to dissipate module heatto the air. As another example, the chassis 130 may contain fluid-filledchannels, allowing heat transfer through the fluid. As a third example,the chassis 130 may contain heat pipes, allowing heat transfer based onboth thermal conduction and phase transition. If the chassis 130includes heat pipes, the heat pipes may include variable conductanceheat pipes and/or diode heat pipes, allowing for variable and/ordirectional heat transfer through the chassis 130.

Passive heat transfer features are preferably fixed to the chassis 130(e.g., cooling fins on an edge of the chassis 130), but may additionallyor alternatively be removably coupled to the chassis 130 (e.g., a clipon heat sink or heat exchange cover).

The chassis 130 may also incorporate an active heat transfer system(e.g. by liquid cooling, thermoelectric devices, active air cooling,etc.). This active heat transfer system is preferably connected to andcontrolled by the MEDES 110.

In one variation of an invention embodiment, the active heat transfersystem preferably enables heat to be transferred preferentially from atleast one location on the chassis 130 to at least one other location onthe chassis 130. The active heat transfer system may additionally oralternatively function to selectively increase or decrease heat transferbetween two locations on the chassis 130. The active heat routing systemmay be used, for instance, to allow a module especially sensitive toheat to be partially thermally isolated from modules that produce largeamounts of heat. As shown in FIG. 20, the active heat routing system mayadditionally or alternatively be used to transfer heat from a modulethat produces large amounts of heat to a heat dissipation site on thechassis 110, allowing heat from that module to be dissipated withouttransferring substantially to surrounding modules. The active heatrouting system is preferably controlled by the MEDES 110. The activeheat routing system is preferably controlled by the MEDES 110 inresponse to temperature data from temperature sensors integrated in thechassis 130, but may additionally or alternatively be controlled inresponse to any suitable data. For example, the active heat routingsystem may be controlled based on temperature data from temperaturesensors embedded in modules (data from which sensors may be transferredby the modules to the MEDES 110).

The chassis 130 may additionally or function to assist in managing theradio-frequency (RF) characteristics of the system 100. For instance,the chassis 130 might be designed to electromagnetically shield modulesfrom one another. As another example, the chassis 130 may include anantenna used for wireless communication (e.g., by the MEDES 110 or bymodules coupled to the system 100). The chassis 130 might also bedesigned to serve as an antenna at one or multiple frequencies forconnected modules or the MEDES 110. The chassis 130 is preferablydesigned for either or both of these functions via the structure andmaterials of the chassis 130.

An antenna coupled to the chassis 130 may be connected to transceiversin a variety of ways. For example, the chassis 130 may include anantenna interface that connects to a corresponding interface on amodule, allowing the antenna to connect to a transceiver through themodule (potentially a transceiver in the module). As another example, anantenna may connect to conductive wires contained within the chassis 130that allow for the antenna to be connected to a transceiver in a moduleand/or in the chassis 130. In this example, the antenna may connectdirectly to a transceiver or indirectly; e.g., through an antennaswitch.

If the chassis 130 or part of the chassis 130 serves as an antenna, thechassis 130 may be modified to enhance antenna performance. As shown inFIG. 21, in one example, an antenna is formed using one side of thechassis, which is electrically isolated from the rest of the chassis(which may serve as a ground, for instance).

The chassis 130 may additionally include sensors, actuators and/or otherdevices used to enhance functionality of the system 100. For instance,the chassis 130 may include self-diagnostic sensors (e.g. thermalsensors, electrical sensors, magnetic sensors). Self-diagnostic sensorspreferably couple to the MEDES 110 and provide information about thestate of the system 100 to the MEDES 110. One example of self-diagnosticsensors is a network of thermal sensors embedded in the chassis 130 thatprovide information on the temperature of the chassis 130 at variouslocations.

If the chassis 130 includes thermal sensors, the thermal sensors arepreferably integrated into the chassis 130, but may additionally oralternatively be integrated into the MEDES 110, into the modules, and/orin any other suitable location. The thermal sensors preferablycommunicate temperature data to the MEDES 110, but may additionally oralternatively communicate temperature data to modules or any othersuitable recipient. Temperature data may include temperature readings,data convertible to temperature readings (e.g. the voltage across athermocouple), or any other suitable temperature data. The thermalsensors may be thermistors, resistance temperature detectors (RTDs),thermocouples, silicon bandgap temperature sensors, infrared sensors, orany other suitable thermal sensors. If the system 100 includesthermoelectric devices, those devices may additionally or alternativelybe used to measure temperature differences across their junctions usingthe Seebeck effect.

In particular, the thermal sensors may include printed circuit boardtrace RTD sensors. PCB trace RTD sensors preferably measure temperaturebased on the changing resistance of a trace of a printed circuit board(PCB). This allows the thermal sensors to be integrated into othercomponents. The PCB trace RTD sensors are preferably integrated intocircuit boards of the MEDES 110, but may additionally or alternativelybe integrated into any suitable circuit board, including circuit boardspurpose built for thermal sensing.

The chassis 130 may also include sensors that are useful for a varietyof mobile electronic devices (e.g. accelerometers, microphones, etc.) sothat a module may not be needed for those sensors. The chassis 130 mayalso include actuators for similar reasons; for instance, a generalpurpose button that could be used as a power button, camera shutterbutton, etc. Other actuators might relate to the functions of the system100; for instance, if modules are locked into module couplers 120 (e.g.by electrically controlled pins), the chassis 130 might integrate amodule release button.

The chassis 130 may also include output devices to free up module space(e.g. a white LED that could be used as a flashlight/camera flash) or torelay system information (e.g. a red LED that could indicate if theMEDES 110 has power). As another example, the chassis 130 might includeantennas that could connect to modules and/or the MEDES 110.

In a variation of an invention embodiment, the system 100 may notinclude a MEDES 110, with the functionality of the MEDES 110 insteadbeing performed by modules coupled to the system 100. This might be thecase for modules with self-contained power sources and wirelesstransceivers, where the communication network between said modules couldbe wholly enabled by hardware and software contained in the modules. Inthis case, the chassis 130 preferably provides structural support forthe modules, and may additionally align the modules to assist in orenable wireless communication between them.

As a person skilled in the art will recognize from the previous detaileddescription and from the figures and claims, modifications and changescan be made to the invention embodiments of the invention withoutdeparting from the scope of this invention defined in the followingclaims.

We claim:
 1. A system for enabling a chassis-coupled modular mobileelectronic device comprising: a thermally conductive chassis, thechassis comprising a set of module couplers that removably andmechanically couple modules of the modular mobile electronic device tothe chassis; a module communication network configured to enable datatransfer between the modules through the module communication networkwhen the modules are coupled to the chassis; a module power networkconfigured to enable power transfer between the modules when the modulesare coupled to the chassis; wherein the set of module couplers thermallycouple modules of the modular mobile electronic device to the chassis; aplurality of thermal sensors coupled to the chassis; wherein at leastone of the plurality of thermal sensors is located in a module couplerof the set of module couplers.
 2. The system of claim 1, wherein atleast one of the plurality of thermal sensors is located in each modulecoupler of the set of module couplers.
 3. The system of claim 1, whereinthe plurality of thermal sensors comprises printed circuit board traceresistance temperature detectors.
 4. The system of claim 1, wherein theplurality of thermal sensors comprises thermocouples.
 5. The system ofclaim 1, further comprising cooling fins fixed to an edge of thechassis.
 6. The system of claim 2, further comprising an active heattransfer system, wherein the active heat transfer system is controlledby the system in response to temperature data from the plurality oftemperature sensors.
 7. The system of claim 6, wherein the active heattransfer system routes heat from a first module coupler of the set ofmodule couplers to a second module coupler of the set of modulecouplers; wherein the first module coupler is at a higher temperaturethan the second module coupler.
 8. The system of claim 6, wherein theactive heat transfer system comprises a thermoelectric device.
 9. Thesystem of claim 8, wherein the thermoelectric device is used to measuretemperature using the Seebeck effect.
 10. The system of claim 1, furthercomprising an active heat transfer system, wherein the active heattransfer system is controlled by the system in response to temperaturedata from module temperature sensors; wherein the temperature data istransferred to the system over the module communication network.
 11. Asystem for enabling a chassis-coupled modular mobile electronic devicecomprising: an electrically conductive chassis, the chassis comprising aset of module couplers, that removably and mechanically couple modulesof the modular mobile electronic device to the chassis; a modulecommunication network configured to enable data transfer between themodules through the module communication network when the modules arecoupled to the chassis; a module power network configured to enablepower transfer between the modules when the modules are coupled to thechassis; and an antenna, coupled to the chassis.
 12. The system of claim11, wherein the antenna is a microstrip antenna.
 13. The system of claim12, wherein the antenna is removable from the chassis.
 14. The system ofclaim 11, wherein the antenna is a structural element of the chassis.15. The system of claim 14, wherein the antenna is electrically isolatedfrom a remaining part of the chassis; wherein the remaining part of thechassis serves as a ground for the antenna.
 16. The system of claim 11,further comprising a button fixed to the chassis.
 17. The system ofclaim 16, wherein the button releases modules from the set of modulecouplers.
 18. The system of claim 11, further comprising anaccelerometer, wherein the accelerometer is fixed to the chassis. 19.The system of claim 18, further comprising a light emitting diode fixedto the chassis.
 20. The system of claim 19, wherein the light emittingdiode represents a power status of the module power network.